As electronics become smaller and more complex, fragility and thermal performance are top challenges for design engineers. Featuring a soft silicone material and very low residual pressure, the Tflex™ HD7.5 thermal gap filler puts minimal pressure on fragile components. With a thermal conductivity of 7.5W/ mk, the gap filler provides high thermal performance without adding stress to devices.
A soft solution for small, sensitive components, Tflex HD7.5 provides heat transfer for telecom, datacom, consumer electronics and industrial applications.
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