– Tflex HD7.5

Soft gapfiller 7.5 W/mK

Info
Ladda ner

Laird’s Tflex™ HD7.5 gapfiller is a new developed very soft  silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™HD7.5 is designed to provide superior pressure versus deflectioncharacteristics.  The material will provideminimal stress on components during application while maintaining low thermalresistance.  As a result, less mechanicaland thermal stresses will be experienced within your device.

Features and benefits - Tflex HD7.5 Gapfiller

  • 7.5W/mK thermal conductivity soft pad
  • Lowpressure versus deflection
  • Minimizesboard and component stress
  • Low outgassing and oil bleeding 
  • Thickness range from 1mm to 5mm

Technical data - Tflex HD7.5 Gapfiller

Construction & CompositionCeramic filled silicone sheet
ColorGrey
Thickness Range1mm (0.040”) - 5mm (0.200”)
Thermal Conductivity (W/mK)7.5
Density (g/cc)3.4
Hardness Shore 00 (3 sec)15
Hardness Shore 000 (3 sec)60
Outgassing TML (weight %)0.20
Outgassing CVCM (weight %)0.02
Temperature Range-40°C to 125°C
Rth at 1mm, 10 psi0.119°C–in2/W
Dielectric Constant at 1 MHz7.94
UL Flammability RatingV-0
Volume Resistivity1.1X1014Ω.cm

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Laird’s Tflex™ HD7.5 gapfiller is a new developed very soft  silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™HD7.5 is designed to provide superior pressure versus deflectioncharacteristics.  The material will provideminimal stress on components during application while maintaining low thermalresistance.  As a result, less mechanicaland thermal stresses will be experienced within your device.

Features and benefits - Tflex HD7.5 Gapfiller

  • 7.5W/mK thermal conductivity soft pad
  • Lowpressure versus deflection
  • Minimizesboard and component stress
  • Low outgassing and oil bleeding 
  • Thickness range from 1mm to 5mm

Technical data - Tflex HD7.5 Gapfiller

Construction & CompositionCeramic filled silicone sheet
ColorGrey
Thickness Range1mm (0.040”) - 5mm (0.200”)
Thermal Conductivity (W/mK)7.5
Density (g/cc)3.4
Hardness Shore 00 (3 sec)15
Hardness Shore 000 (3 sec)60
Outgassing TML (weight %)0.20
Outgassing CVCM (weight %)0.02
Temperature Range-40°C to 125°C
Rth at 1mm, 10 psi0.119°C–in2/W
Dielectric Constant at 1 MHz7.94
UL Flammability RatingV-0
Volume Resistivity1.1X1014Ω.cm

General info

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Lars Falk

EMI, thermal and display enhancement

P: +46 (0) 8 121 519 58

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