– Tflex SF600

Gapfiller silicone free 3.0 W/mK

Info
Ladda ner

Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3.0 W/mK. Tflex™ SF600 is designed for applications which are silicone sensitive. This material is RoHS compliant.

Features and benefits:
  • Silicone-free gap pad
  • Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
  • Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
  • Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments
  •  
Applications:
  • Automotive applications
  • Applications involving optical components
  • Flat panel displays
  • Hard drives
  •  

Technical data

   
 
Tflex SF600
Test method
MaterialBoron Nitride filled gap pad 
Thickness0,25-3,56mm 
Hardness Shore0080ASTM D2240
Thermal conductivity3,0 W/mK 
   
Flammability ratingV0 (pending)UL 94
Temperature range-20°C – 125°C 

Manufacturer: Laird


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Tflex™ SF600 is a high performance, silicone-free thermal gap filler with a conductivity of 3.0 W/mK. Tflex™ SF600 is designed for applications which are silicone sensitive. This material is RoHS compliant.

Features and benefits:
  • Silicone-free gap pad
  • Thermal Conductivity for material thicknesses of 10 to 30 mils is 2.8 W/mK
  • Thermal Conductivity for material thicknesses of 40 to 140 mils is 3.0 W/mK
  • Available in thicknesses from 0.010-inch (0.25 mm) through 0.140-inch (3.56 mm) in 0.010-inch increments
  •  
Applications:
  • Automotive applications
  • Applications involving optical components
  • Flat panel displays
  • Hard drives
  •  

Technical data

   
 
Tflex SF600
Test method
MaterialBoron Nitride filled gap pad 
Thickness0,25-3,56mm 
Hardness Shore0080ASTM D2240
Thermal conductivity3,0 W/mK 
   
Flammability ratingV0 (pending)UL 94
Temperature range-20°C – 125°C 

Manufacturer: Laird


General info

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Lars Falk

EMI, thermal and display enhancement

P: +46 (0) 8 121 519 58

Email

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