Tflex HP34 is the latest addition to Laird’s wide range of thermal interface materials.
This product suits many applications where very high thermal performance is needed. Silicone-free composition makes it suitable even where gap-fillers are usually avoided due to their silicone content.
Tflex HP34 is a graphite-based gap filler with oriented fibers providing a very high internal thermal conductivity, 34W/mK. Compared to other graphite-based thermal materials, the Tflex HP34 is significantly softer. This improves adaption to any surface unevenness, which lowers the thermal resistance across the interface. A high-performance soft graphite-based silicone-free gap filler with high thermal conductivity and low thermal contact resistance.