Gustav Dyvling
Mid Sweden
Tel: +46 (0) 790 064 471
Laird’s Tflex™ HD7.5 gapfiller is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™HD7.5 is designed to provide superior pressure versus deflectioncharacteristics. The material will provideminimal stress on components during application while maintaining low thermalresistance. As a result, less mechanicaland thermal stresses will be experienced within your device.
Features and benefits - Tflex HD7.5 Gapfiller
- 7.5W/mK thermal conductivity soft pad
- Lowpressure versus deflection
- Minimizesboard and component stress
- Low outgassing and oil bleeding
- Thickness range from 1mm to 5mm
Technical data - Tflex HD7.5 Gapfiller
| Construction & Composition | Ceramic filled silicone sheet |
| Color | Grey |
| Thickness Range | 1mm (0.040”) - 5mm (0.200”) |
| Thermal Conductivity (W/mK) | 7.5 |
| Density (g/cc) | 3.4 |
| Hardness Shore 00 (3 sec) | 15 |
| Hardness Shore 000 (3 sec) | 60 |
| Outgassing TML (weight %) | 0.20 |
| Outgassing CVCM (weight %) | 0.02 |
| Temperature Range | -40°C to 125°C |
| Rth at 1mm, 10 psi | 0.119°C–in2/W |
| Dielectric Constant at 1 MHz | 7.94 |
| UL Flammability Rating | V-0 |
| Volume Resistivity | 1.1X1014Ω.cm |
