High performance 7.5 W/mK thermal phase change material.
Enhance cooling in electronics
With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to help engineers overcome stringent thermal challenges and efficiently cool electronics. This new phase change material offers the lowest thermal resistance on the market. As it softens between 50°C –70°C, the initial pad’s thickness can decrease to a bondline as thin as 35µ.
Performance across industries
Tpcm™ 7000 ships on liners yet is easily removable for application. The phase change material offers a high-performance and reliable thermal solution for consumer electronics, as well as datacom and telecom and industrial applications. Features and benefits of Tpcm™ 7000 include:
- Easy application and automation
- 7.5 W/mK bulk thermal conductivity
- No pump out
- Long-term reliability
- Non-silicone formulation that provides naturally tacky surface
- Environmentally friendly solution
RoHS and REACH compliant.
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