Laird gap fillers are used to bridge the interface between hot components and a chassis or heat sink assembly to increase the overall heat transfer from the system.
The unique combination of thermal conductivity and softness reduces mechanical stress while maintaining thermal performance
Tflex SF10 is a soft, non-silicone gap filler that offers superior thermal performance for applications across industries, including consumer electronics, industrial and telecom.
The silicone free material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components.
Very little pressure is required to reach the lowest possible thermal resistance.