– Tgard 100

Electrically Insulating, 3,5W/mK 6000V

Info
Ladda ner

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron nitrate composite. It is specially designed to maximize high thermal and electrical isolation performance for wide variety of applications. The unique formulation offers an excellent smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.

Tgard™ 100 is ideal for applications that require low component mounting forces include discrete semiconductors mounted with clips.

Features and benefits
  • High thermal conductivity of 3.5W/mK
  • High breakdown voltage of 6,000 volts
  • Unique formulation minimizes thermal resistance at low mounting forces
Applications
  • Switch mode power supplies for several applications
  • Motor controllers
  • Power equipment

Manufacturer: Laird

Technical data

 
Tgard 100
 
MaterialSilicone/boron nitride-composite 
Thickness0.254mm 
Hardness90 ShoreAASTM D2240
Flammability ratingV0UL94
Temperature range-60°C – 180°C 
Thermal resistance @ 69kPa (10psi)2.439 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 345kPa (50psi)1.801 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 2758kPa (400psi)1.606 °C-cm²/WMod. ASTM D5470

Standard thickness: 0.254mm

Configurations available: Sheet form, roll form and die-cut parts

Single side, pressure sensitive adhesive on request

Standard options: Without adhesive (A0): 18.5” x 18.5” sheet , With adhesive (A1): 9” x 18” sheet

Standard die-cut parts: Standard part sizes for TO-220, TO-247, TO-3P, TO-3PL and TO-264v

Custom die-cut parts: Custom configurations available with standard tolerance of 0.5mm (0.020”)


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Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron nitrate composite. It is specially designed to maximize high thermal and electrical isolation performance for wide variety of applications. The unique formulation offers an excellent smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.

Tgard™ 100 is ideal for applications that require low component mounting forces include discrete semiconductors mounted with clips.

Features and benefits
  • High thermal conductivity of 3.5W/mK
  • High breakdown voltage of 6,000 volts
  • Unique formulation minimizes thermal resistance at low mounting forces
Applications
  • Switch mode power supplies for several applications
  • Motor controllers
  • Power equipment

Manufacturer: Laird

Technical data

 
Tgard 100
 
MaterialSilicone/boron nitride-composite 
Thickness0.254mm 
Hardness90 ShoreAASTM D2240
Flammability ratingV0UL94
Temperature range-60°C – 180°C 
Thermal resistance @ 69kPa (10psi)2.439 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 345kPa (50psi)1.801 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 2758kPa (400psi)1.606 °C-cm²/WMod. ASTM D5470

Standard thickness: 0.254mm

Configurations available: Sheet form, roll form and die-cut parts

Single side, pressure sensitive adhesive on request

Standard options: Without adhesive (A0): 18.5” x 18.5” sheet , With adhesive (A1): 9” x 18” sheet

Standard die-cut parts: Standard part sizes for TO-220, TO-247, TO-3P, TO-3PL and TO-264v

Custom die-cut parts: Custom configurations available with standard tolerance of 0.5mm (0.020”)


General info

Supplier

Category

Mounting

Application

Attributes

Ask us

Gustav Dyvling

Mid Sweden

P: +46 (0) 790 064 471

Email

Markus Ödlund

Southeast Sweden

P: +46 (8) 121 519 60

Email

Martin Jonsson

Western Sweden & Denmark

P: +46 8-121 519 63

Email

Helena Benjamin

Northern Sweden

P: +46 (0) 8 121 519 62

Email

Niclas Qvist

Key account Sweden

P: +46 (0) 8 121 519 57

Email

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