Gustav Dyvling
Mid Sweden
Tel: +46 (0) 790 064 471
T-flex™ 500 is a highly conformable gap filler designed to provide excellent thermal performance while remaining cost effective. This soft interface pad conforms well with minimal pressure, resulting in little or no stress on the mating parts.
T-flex™ 500’s unique silicone formulation has extremely low silicone extractables compared to other silicone interface materials and also meets NASA outgassing requirements.
T-flex™ 500 is naturally tacky, requiring no adhesive coating to inhibit thermal performance. T-flex™ 500 is electrically insulating, stable from -45ºC to 200ºC and meets UL 94V0 rating.
Features and Benefits:
- Highly conformable and cost effective
- Low thermal resistance at low pressures
- Designed to have very low silicone extractables
- Meets NASA Outgassing requirements
- Available in thicknesses from 0.020" (0.5mm) to 0.200" (5.0mm)
- Naturally tacky needing no further adhesive coating
- Low silicone extractibles
Applications:
- Cooling components to the chassis or frame
- High speed mass storage drives
- RDRAM memory modules
- Heat pipe thermal solutions
- Automotive engine control units
- Telecommunication hardware
Technical data
Tflex500 | Test method | |
| Material | Filled silicone elastomer | |
| Thickness | 0,5-5,0mm | |
| Hardness Shore00 | 40 | ASTM D2240 |
| Thermal conductivity | 2,8 W/mK | |
| Outgassing TML | 0,29 % | ASTM E595 |
| Outgassing CVCM | 0,04 % | ASTM E595 |
| Flammability rating | 94 V0 | UL |
| Temperature range | -50°C – 200°C |
Standard thicknesses from 0,5mm to 5,0mm. Reinforced: 0,5mm – 0,76mm.
Manufacturer: Laird
