Gustav Dyvling
Mid Sweden
Tel: +46 (0) 790 064 471
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production.
Features and benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Thermal conductivity of 1.2 W/mK
- Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
- Low compression set enables the pad to be reused many times
Applications
- Notebook and desktop computers
- Telecommunication hardware
- Flat panel displays
- Memory modules
- Automotive electronics
Technical data
Tflex300 | Test method | |
| Material | Filled silicone elastomer | |
| Thickness | 0,5-5,0mm | |
| Hardness Shore00 | 50 | ASTM D2240 |
| Thermal conductivity | 1.2 W/mK | |
| Flammability rating | 94 V0 | UL |
| Temperature range | -40°C – 160°C |
