– Tgard 100

Electrically Insulating, 3,5W/mK 6000V

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Ladda ner

Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron nitrate composite. It is specially designed to maximize high thermal and electrical isolation performance for wide variety of applications. The unique formulation offers an excellent smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.

Tgard™ 100 is ideal for applications that require low component mounting forces include discrete semiconductors mounted with clips.

Features and benefits
  • High thermal conductivity of 3.5W/mK
  • High breakdown voltage of 6,000 volts
  • Unique formulation minimizes thermal resistance at low mounting forces
Applications
  • Switch mode power supplies for several applications
  • Motor controllers
  • Power equipment

Manufacturer: Laird

Technical data

 
Tgard 100
 
MaterialSilicone/boron nitride-composite 
Thickness0.254mm 
Hardness90 ShoreAASTM D2240
Flammability ratingV0UL94
Temperature range-60°C – 180°C 
Thermal resistance @ 69kPa (10psi)2.439 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 345kPa (50psi)1.801 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 2758kPa (400psi)1.606 °C-cm²/WMod. ASTM D5470

Standard thickness: 0.254mm

Configurations available: Sheet form, roll form and die-cut parts

Single side, pressure sensitive adhesive on request

Standard options: Without adhesive (A0): 18.5” x 18.5” sheet , With adhesive (A1): 9” x 18” sheet

Standard die-cut parts: Standard part sizes for TO-220, TO-247, TO-3P, TO-3PL and TO-264v

Custom die-cut parts: Custom configurations available with standard tolerance of 0.5mm (0.020”)


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Tgard™ 100 is a high thermal performance insulator pad consisting of silicone/boron nitrate composite. It is specially designed to maximize high thermal and electrical isolation performance for wide variety of applications. The unique formulation offers an excellent smooth and compliant surface which minimizes interfacial thermal resistance at low mounting forces.

Tgard™ 100 is ideal for applications that require low component mounting forces include discrete semiconductors mounted with clips.

Features and benefits
  • High thermal conductivity of 3.5W/mK
  • High breakdown voltage of 6,000 volts
  • Unique formulation minimizes thermal resistance at low mounting forces
Applications
  • Switch mode power supplies for several applications
  • Motor controllers
  • Power equipment

Manufacturer: Laird

Technical data

 
Tgard 100
 
MaterialSilicone/boron nitride-composite 
Thickness0.254mm 
Hardness90 ShoreAASTM D2240
Flammability ratingV0UL94
Temperature range-60°C – 180°C 
Thermal resistance @ 69kPa (10psi)2.439 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 345kPa (50psi)1.801 °C-cm²/WMod. ASTM D5470
Thermal resistance @ 2758kPa (400psi)1.606 °C-cm²/WMod. ASTM D5470

Standard thickness: 0.254mm

Configurations available: Sheet form, roll form and die-cut parts

Single side, pressure sensitive adhesive on request

Standard options: Without adhesive (A0): 18.5” x 18.5” sheet , With adhesive (A1): 9” x 18” sheet

Standard die-cut parts: Standard part sizes for TO-220, TO-247, TO-3P, TO-3PL and TO-264v

Custom die-cut parts: Custom configurations available with standard tolerance of 0.5mm (0.020”)


General info

Supplier

Category

Mounting

Application

Attributes

Ask us

Lars Falk

EMI, thermal and display enhancement

P: +46 (0) 8 121 519 58

Email

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